1. 2. 3. material content data sheet sales product name bc 850bw h6327 issued 29. august 2013 ma# MA000854920 package pg-sot323-3-1 weight* 5.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 12 noble metal gold 7440-57-5 0.007 0.12 1230 inorganic material silicon 7440-21-3 0.025 0.42 0.54 4203 5446 leadframe inorganic material silicon 7440-21-3 0.001 0.01 88 non noble metal titanium 7440-32-6 0.003 0.04 441 non noble metal chromium 7440-47-3 0.008 0.13 1323 non noble metal copper 7440-50-8 2.617 43.91 44.09 439039 440891 wire non noble metal copper 7440-50-8 0.008 0.13 0.13 1294 1294 encapsulation organic material carbon black 1333-86-4 0.031 0.53 5284 plastics epoxy resin - 0.677 11.36 113612 inorganic material silicondioxide 60676-86-0 2.441 40.95 52.84 409531 528427 leadfinish non noble metal tin 7440-31-5 0.133 2.23 2.23 22263 22263 plating noble metal silver 7440-22-4 0.010 0.17 0.17 1680 1680 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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